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Conprofe Introduces Innovative Machining Solution for Semiconductor Industry at 2022 CSEAC

At the 10th (2022) 2021 China Semiconductor Equipment Annual Conference (CSEAC) was held in Wuxi Taihu International Expo Center on November 27-29, Conprofe exhibited its feature products including Ultrasonic-Green Machine Tools, Solid PCD Cutting Tools, Ultrasonic Tool Holders, Precision Tool… Read More »Conprofe Introduces Innovative Machining Solution for Semiconductor Industry at 2022 CSEAC

UGV-856test

[rank_math_breadcrumb] Previous image Next image UGV-856996 Ideally suited for machining small and medium-sized gear boxes, plates, discs, valves, shells, molds and other complex parts in industries of precision parts, consumable electronics, hardware, automotive, medical equipment, etc. Features Video Download Features… Read More »UGV-856test

UGV-856

[rank_math_breadcrumb] Previous image Next image UGV-856 Ideally suited for machining small and medium-sized gear boxes, plates, discs, valves, shells, molds and other complex parts in industries of precision parts, consumable electronics, hardware, automotive, medical equipment, etc. Features Video Download Features… Read More »UGV-856

UGT-500

[rank_math_breadcrumb] Previous image Next image UGT-500 Ideally suited for drilling, tapping and milling small plates, discs and housings for consumable electronics, automotive, aerospace, medical field, etc. Features Video Download Features -Global pioneering drilling and tapping center integrated with both ultrasonic… Read More »UGT-500

UGV200-5AXIS

[rank_math_breadcrumb] UGV200-5AXIS Ideally suited for high-precision and high-efficiency 5-axis simultaneous ultrasonic or traditional machining of geometrically complicated workpieces of hard-brittle materials (ceramics, sapphire, glass, etc.), carbon fiber reinforced plastics and metal materials Features Video Download Features -Ultrasonic spindle independently developed… Read More »UGV200-5AXIS

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