At the 10th (2022) 2021 China Semiconductor Equipment Annual Conference (CSEAC) was held in Wuxi Taihu International Expo Center on November 27-29, Conprofe exhibited its feature products including Ultrasonic-Green Machine Tools, Solid PCD Cutting Tools, Ultrasonic Tool Holders, Precision Tool Holders and other core technological products. Besides, its unique one-stop machining solutions for semiconductor industry has won great recognition from semiconductor industry.

Conprofe’s one-stop machining solution for semiconductor industry is a solution that features a combination of core technological products, including Conprofe’s ultrasonic machine tools, ultrasonic machining system, ultrasonic press-fit tool holders or ultrasonic shrink-fit tool holders, solid PCD drill bits or solid PCD thread milling tools, etc. The solution provides efficient and green machining for a variety of materials such as monocrystalline silicon, quartz glass, silicon carbide, aluminum-based silicon carbide and other materials that are commonly seen in semiconductor industry.

The one-stop machining solution for the semiconductor industry has been tried and proved through a large number of market application, and its machining effects has been unanimously recognized. We are hoping the extensive application of high-end innovative ultrasonic-green machine tools and its precision components can further advance the upgrading of manufacturing technologies for semiconductor industry and thus improving machining efficiency and surface quality.

For more information, please contact us!