Conprofe Technology Co., Ltd.

Material: Quartz Glass

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Cavity Chamfer Grinding

Benefits: Chipping size down by 88.7%, from 0.433mm to 0.049mm; Minimized sub-surface damage (SSD) and lower cutting area temperature; Roughness: Ra<0.6μm, as a result of better surface quality; Profile tolerance up to 0.015mm

Material: Quartz Glass

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Ultrasonic Machining System + Linear Motor

Features: D0.03*0.2mm Micro-Hole Drilling

Benefits: Improved tool life from immediate tool breakage to 10 holes; Min. cycle time: 270s per hole; Significant accuracy and stability improvement

Material: Alumina Ceramic

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D0.06mmX0.5mm Micro-Hole Machining

Benefits: Tool life shows a 9.7-fold increase, from 15 holes to 161 holes; Cycle time down by 62%; Stable drilling of micro-holes (D0.06mmX0.5mm with depth-diameter ratio of 8.3:1)

Material: 316L Stainless Steel

Machine Tool: ULW-400

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D8.0±0.01mm / D6.0±0.01mm Hole Reaming

Benefits: Reduced cutting force, facilitating chip evacuation; Burr-free hole wall at the intersections, and mirror-finish surface; No chipping and tool breakage

Material: AlN Ceramic

Machine Tool: Ultrasonic-Green Vertical Deep Hole Drilling Center UVD-1165

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D2.2x15mm/D4.0x160mm Deep Hole Machining

Benefits: Stable machining of D2.2x15mm (depth-diameter ratio of 6.8:1) and D4.0x160mm (depth-diameter ratio of 40:1) through-holes; Ultrasonic technology + electroplated grinding head results in uniform edges on both sides of the hole with minimal chipping; No obvious wear of grinding head