Cases by Materials-Conprofe Technology Group Co., Ltd.

Cases by Materials

Hard-Brittle Materials Composite Materials Difficult-to-Cut Metals

Cases by Industries

Semiconductors Aviation & Aerospace Medical Automotive Consumer Electronics

Cases by Machine Tools

Engraving & Milling Centers Vertical 5-Axis Machining Centers 5-Axis Gantry Machining Centers Graphite Machining Centers Lightweight Vertical 5-Axis Machining Centers

Showerhead

Material: Quartz Glass (HV700)

Machine Tool: UEM-600

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x5.0mm Hole Drilling

Benefits: Continuous drilling of 1,200 D0.5x5mm holes (with depth-diameter ratio of 10:1) ; Cycle time reduced by 72%, from 270s to 75s per hole; Hole edge chipping decreased by 68%, from 0.4mm to 0.13mm

Substrate

Material: Quartz Glass

Machine Tool: UEM-400

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Chamfer and Side Machining (Required Roughness: Ra<150nm)

Benefits: Cycle time down by 79%, from 120min/pc to 25min/pc; Surface roughness down by 82%, from Ra 560nm to <100nm, without grinding marks

Showerhead

Material: Silicon Carbide (HV2,700)

Machine Tool: UEM-500

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x6.5mm/D1x6.5mm Stepped Hole Drilling

Benefits: Continuously drilling over 100 holes; Smooth hole wall and hole edge chippings of less than 0.02mm

Wafer Disc

Material: Silicon Carbide

Machine Tool: UEM-500

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Cavity Grinding and Grooving

Benefits: Cutting force reduction with ultrasonic-assisted machining; Less chippings; Cycle time down by 48%, from 888 mins to 462 mins; Tool life up by 100%, from 159 mins to 317 mins

AlSiC Workpiece

Material: AISiC (60% SiC)

Machine Tool: UEM-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill + Thread Mill

Features: Thread Hole Drilling

Benefits: Wall thickness of 0.5mm without any cracks and chippings; Tool life improved by 800 times, from 1/4 hole to 200 holes

Single-Crystal Silicon Ring

Material: Single-Crystal Silicon

Machine Tool: UEM-600

Industry: Semiconductors

Solution: Vertical DDR High-Speed Rotary Table

Features: Profile Grinding

Benefits: Cycle time down by 67%, from 408s to136s; Workpiece surface roughness down by 80%, from Ra 0.30μm to Ra 0.06μm

Optical Fiber Preform

Material: Quartz Glass

Machine Tool: UGT-500

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Through-Hole Drilling (D7.8x250mm with 32xD)

Benefits: Hole wall roughness Sa<0.122μm; Holes parallelism <0.013mm

Graphite Crucible

Material: Graphite

Machine Tool: UPG-500

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Cavity Milling

Benefits: Cutting force reduction with ultrasonic-assisted machining; Cycle time significantly down by 12.5%, from 240mins to 210mins; Multi-layer protection and long tool life

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