Semiconductors-Conprofe Technology Group Co., Ltd.

Cases by Materials

Hard-Brittle Materials Composite Materials Difficult-to-Cut Metals

Cases by Industries

Semiconductors Aviation & Aerospace Medical Automotive Consumer Electronics

Cases by Machine Tools

Engraving & Milling Centers Vertical 5-Axis Machining Centers 5-Axis Gantry Machining Centers Graphite Machining Centers Lightweight Vertical 5-Axis Machining Centers

Engineering Plastic Probe Card

Material: Dupont Engineering Plastic VESPEL SCP5000

Machine Tool: ULW-600 PLUS

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.22mm / D0.31mm Stepped Hole Drilling

Benefits: Stable micro-hole drilling for D0.22mm / D0.31mm holes; Minimum hole pitch: 0.35mm; the thinnest hole wall: 0.12mm, with excellent wall thickness uniformity and integrity; Burr size reduced by 72%, from 0.095mm to 0.027mm; Burr coverage ratio reduced from 5% to as low as 1%, cutting downstream process costs and improving downstream process yield

CVD SiC Showerhead

Material: CVD SiC (HV 3,150)

Machine Tool: ULW-600 PLUS

Industry: Semiconductors

Cutting Tool: High-Speed PCD Drill

Features: D1.0x5.8mm/D0.5x5.4mm Stepped Hole Drilling

Benefits: Efficiency up by 47.8%, from 11ʹ25ʺ to 5ʹ58ʺ per D1.0/D0.5mm stepped hole; Tool life up by 160%, with machining cost down by 50%; Edge chipping ≤ 0.02mm at hole entrance (under ×50 magnification)

Single Crystal Silicon Curved Electrode

Material: Single-Crystal Silicon

Machine Tool: ULW-600

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.45x24.75mm Ultra-Deep Micro-Hole Drilling

Benefits: Continuous machining of over 2,000 ultra-deep holes; Hole roundness up to 0.003mm; Hole wall roughness down by 99.8%, from Sa 6.540μm to Sa 0.013μm

Polysilicon Confinement Ring

Material: Polysilicon

Machine Tool: ULW-600

Industry: Semiconductors

Solution: Vertical DDR High-Speed Rotary Table

Features: Contouring, grinding and grooving

Benefits: Edge chipping decreased by 75%, from 0.12mm to 0.03mm; Cycle time reduced by 21%, from 208h to 165h; Improved roundness

Showerhead

Material: Quartz Glass (HV700)

Machine Tool: ULW-600

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x5.0mm Hole Drilling

Benefits: Continuous drilling of 1,200 D0.5x5mm holes (with depth-diameter ratio of 10:1) ; Cycle time reduced by 72%, from 270s to 75s per hole; Hole edge chipping decreased by 68%, from 0.4mm to 0.13mm

Substrate

Material: Quartz Glass

Machine Tool: ULW-400

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Chamfer and Side Machining (Required Roughness: Ra<150nm)

Benefits: Cycle time down by 79%, from 120min/pc to 25min/pc; Surface roughness down by 82%, from Ra 560nm to <100nm, without grinding marks

Showerhead

Material: Silicon Carbide (HV3,150)

Machine Tool: ULW-600

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D1.0x5.8mm/D0.5*5.4mm Stepped Hole Drilling

Benefits: Machining efficiency up by 47.8%, from 11'25" to 5'58" per D1.0/D0.5mm stepped hole; Tool life up by 160%, with machining cost down by 50%; Edge chipping ≤ 0.02mm at hole entrance (under x50 magnification)

Wafer Disc

Material: Silicon Carbide

Machine Tool: ULW-500

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Cavity Grinding and Grooving

Benefits: Cutting force reduction with ultrasonic-assisted machining; Less chippings; Cycle time down by 48%, from 888 mins to 462 mins; Tool life up by 100%, from 159 mins to 317 mins

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