Cases by Industries-Conprofe Technology Group Co., Ltd.

Cases by Materials

Hard-Brittle Materials Composite Materials Difficult-to-Cut Metals

Cases by Industries

Semiconductors Aviation & Aerospace Medical Automotive Consumer Electronics

Cases by Machine Tools

Engraving & Milling Centers Vertical 5-Axis Machining Centers 5-Axis Gantry Machining Centers Graphite Machining Centers Lightweight Vertical 5-Axis Machining Centers

Single-Crystal Silicon Ring

Material: Single-Crystal Silicon

Machine Tool: UEM-600

Industry: Semiconductors

Solution: Vertical DDR High-Speed Rotary Table

Features: Profile Grinding

Benefits: Cycle time down by 67%, from 408s to136s; Workpiece surface roughness down by 80%, from Ra 0.30μm to Ra 0.06μm

Optical Fiber Preform

Material: Quartz Glass

Machine Tool: UGT-500

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Through-Hole Drilling (D7.8x250mm with 32xD)

Benefits: Hole wall roughness Sa<0.122μm; Holes parallelism <0.013mm

Graphite Crucible

Material: Graphite

Machine Tool: UPG-500

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Cavity Milling

Benefits: Cutting force reduction with ultrasonic-assisted machining; Cycle time significantly down by 12.5%, from 240mins to 210mins; Multi-layer protection and long tool life

Showerhead

Material: Aluminum Alloy 6061

Machine Tool: UEM-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: D0.7x20mm Through-Hole Drilling (Depth-Diameter Ratio 28.6:1)

Benefits: Qualified hole size; Qualified average hole wall roughness (Ra 0.342μm)

Showerhead

Material: Alumina

Machine Tool: UEM-400

Industry: Semiconductors

Cutting Tool: Solid PCD Drill

Features: D0.5x3.2mm/D1x5.8mm Hold Drilling (6xD)

Benefits: Tool life up by over 34%, from 560 holes to 750 holes

Multi-Dimension Mirror

Material: Quartz Glass

Machine Tool: ULV200-5AXIS

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Profile Grinding

Benefits: Lower cutting force for higher efficiency with ultrasonic-assisted machining; Easier to control polishing dimension with mirror-level roughness of Sa<70nm

Electrode Block

Material: Quartz Glass

Machine Tool: UEM-400

Industry: Semiconductors

Cutting Tool: Solid PCD Micro-Edge Cutting Tool

Features: Through-Hole and End Face Milling and Grooving

Benefits: Cycle time down by 66.7%, from 90min/pc to 30min/pc; Adhere to customers’ required specifications of dimension and precision; Mirror finish by PCD Micro-Edge Cutting Tool, with lower roughness vs. traditional machining

Lightweight Reflector Lens

Material: Quartz Glass

Machine Tool: UEM-600

Industry: Semiconductors

Solution: Ultrasonic Machining System

Features: Cavity Chamfer Grinding

Benefits: Chipping size down by 88.7%, from 0.433mm to 0.049mm; Minimized sub-surface damage (SSD) and lower cutting area temperature; Roughness: Ra<0.6μm, as a result of better surface quality; Profile tolerance up to 0.015mm

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